TL41261
$6.00
Min 1
Specifications
| CONDITION | new |
|---|---|
| Status | Aftermarket Brand |
| Weight | 0.06 kg |
| CONDITION | new |
|---|---|
| Status | Aftermarket Brand |
| Weight | 0.06 kg |
|---|
Senju Tin Soldering Paste
Senju Tin Soldering Paste is a high-performance low-temperature soldering paste that melts at 138°C. Ideal for BGA, SMD, and SMT rework or repair, this paste ensures strong bonding with minimal thermal stress on sensitive components. Suitable for lead-free soldering in microelectronics repair.
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Low melting point: 138°C
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Lead-free formulation
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deal for BGA and SMD rework
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Reduces heat damage to sensitive components
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Perfect for professional PCB repair and soldering labs