Senju Tin Soldering Paste

Senju Tin Soldering Paste is a high-performance low-temperature soldering paste that melts at 138°C. Ideal for BGA, SMD, and SMT rework or repair, this paste ensures strong bonding with minimal thermal stress on sensitive components. Suitable for lead-free soldering in microelectronics repair.

• Low melting point: 138°C

• Lead-free formulation

• deal for BGA and SMD rework

• Reduces heat damage to sensitive components

• Perfect for professional PCB repair and soldering labs